Technical Resources

High temperature stability embedded ReRAM for 2x nm node and beyond

Details of the performance and reliability of Weebit ReRAM integrated in 28nm, highlighting the technology’s intrinsic high reliability

Abstract:

We report the performances and reliability of our ReRAM technology integrated in 28nm node. Low raw BER approaching 10−5 without ECC or redundancy is achieved. 106 cycles endurance without significant window degradation is shown. We report stable memory window after 15h bake at 210°C after 10kcycles, which is one of the best results reported so far to our knowledge. Technology passed basic (3x reflow) and extended (9 cycles) SMT tests with zero failures. Bitcell and memory stack engineering improved the window margin statistics. Optimized forming protocols are developed to increase memory yield over cycling. Program and verify algorithms allowed to insure no overlap between high and low resistive states on 1Mb arrays.

 

Published in: 2022 IEEE International Memory Workshop (IMW)

Date Added to IEEE Xplore25 May 2022

 

Read the High Temperature Stability at 28nm Blog article.