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Glossary

Investors

Glossary

All0-9ABCDEFGHIJKLMNOPQRSTUVWXYZ

0-9

  • 1S1R
  • 1T1R
  • 4F2

A

  • Access Time
  • Analog ICs

B

  • BEOL Memory
  • Bit Cell

C

  • Characterization
  • Chip
  • CMOS
  • CPU
  • Cross-Section
  • Crossbar

D

  • Data Retention
  • Die
  • Discrete Memory
  • DRAM

E

  • Embedded Memory / Embedded NVM
  • Emerging Memory / Emerging NVM
  • Endurance

F

  • Fab
  • FDSOI
  • Flash

G

  • Geometry

I

  • In-Memory Compute / Processing In-Memory

M

  • Mask
  • Memory Cell
  • Memory Module
  • Memristor
  • Microcontroller (MCU)
  • MRAM

N

  • NAND (3D) Flash
  • NAND Flash
  • Nanometer (nm)
  • Neuromorphic Computing
  • Non-volatile Memory (NVM)
  • NOR Flash

O

  • Oxide
  • OxRAM

P

  • Persistent Memory (PM)
  • PMIC

Q

  • Qualification

R

  • Radiation Tolerant / Radiation Hardened (Rad Hard)
  • RAM
  • ReRAM
  • Retention
  • RRAM

S

  • Selector
  • Silicon
  • SiOx
  • Spiking neural networks (SNNs)
  • SRAM
  • Storage Class Memory (SCM)
  • System-on-a-Chip (SoC)

T

  • Tape-out
  • Transistor

V

  • Volatile Memory

W

  • Wafer
  • Wafer Level Packaging (WLP) / Wafer Level Chip Scale Packaging (WLCSP)

Y

  • Yield
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Technology
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  • Meet the ReRAM Bitcell
  • ReRAM Memory Module Technology
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  • Discrete Chip Development
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