BEOL Memory

Semiconductor manufacturing includes both front-end-of-line (FEOL) and back-end-of-line (BEOL) processes. In FEOL, the integrated circuit is formed on the wafer substrate. While FEOL defines and makes the transistors – which are the switching elements used for computing – the BEOL represents the interconnecting layers which connect the transistors on the wafer using metal layer processing techniques. Weebit’s ReRAM is integrated during the BEOL process.